Manufacturers’ Representative | Technical Business Development
Space (New Space – GEO)
Associated Processing Unit (APU) AI processor, Synch and Asynch SRAMs and Low Latency DRAM memory products featuring very high transaction rates, high density, low latency, high bandwidth, fast clock access times, and low power consumption. Mil Temp and space grade radiation tolerant and hardened SRAM. Gemini (APU) patented compute in memory Processor combination of high processing power, large build in memory with tremendous bandwidth and reduced power consumption makes it best in class for AI applications.
Custom and standard products/packaging for Mil/Aero and Space. High reliability optocouplers, LEDs, LED displays, Hall Effect sensors, solid state relays, solid state power controllers, power operational amplifiers, and optically isolated MOSFET switches. Rad hard DC/DC & transceivers.
SMART Modular Technologies
Global leader in the design & manufacture of specialty memory solutions including DRAM modules (SO-DIMM) and flash based SSDs of all form factors.
Memory Component Manufacturer of DRAM, Low Power DRAM and eMMC. Smart Semi offers continuity of supply, competitive pricing, responsive service, Tier 1 component compatibility, high quality, and reliability. Smart Semi also offers long product life cycle support and extended LTB/EOL transitions.
Photo etching, or photo chemical milling, progressive die stamping, plating and laser machining to manufacture light gauge precision parts for military, medical, instrumentation, communications and industrial use. Flexible & Rigid-Flex printed circuits on polyimide substrates using advanced manufacturing processes. Global supplier of standard and custom EMI/RFI shielding products of all types for commercial and military applications.
High-performance, high-reliability signal chain solutions, with a variety of semiconductor and packaging solutions, Teledyne e2v caters to applications in the Space, Mil-Aero, Industrial, Medical and Scientific markets. Expertise includes industry leading Broadband Data Converters, Hi-Rel Microprocessors (PowerPC, PowerQUICC, ARM) and Memory (MRAM, DDR). Teledyne e2v Services include an industry leading Obsolescence Mitigation/Diminishing Manufacturing Sources program as well as Custom Packaging, High Rel PCB Assembly, Component Screening and Qualification.
Leader in the design and manufacture of connectors, cable, cable assemblies, and custom interconnect solutions for Mil-Aero, Industrial, Medical and Transportation applications. Offerings include RF & Microwave, Fiber Optic, Hermetic and multi-pin interconnects, Micro-Miniature.
Leader in the design and manufacture of connectors, cable, cable assemblies, and custom interconnect solutions for Mil-Aero, Industrial, Medical and Transportation applications. Offerings include RF & Microwave, Fiber Optic, Hermetic, Multi-pin and Micro-Miniature.